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  2024 IC Taiwan Grand Challenge Pilot Program - Taipei Economic and Cultural Office in Thailand 駐泰國台北經濟文化辦事處 :::
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2024 IC Taiwan Grand Challenge Pilot Program

2024 IC Taiwan Grand Challenge Pilot Program

1. Introduction
To boost Taiwan's position as a leading IC startup cluster, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. It offers local incentives such as chip tape-out, masks, and IP services, collaborates with leading semiconductor companies for investment, and establishes public-private venture capital funds. These efforts aim to attract global talent and investment, with the goal of making Taiwan a hub for innovative chip technologies.

The IC Taiwan Grand Challenge will will spotlight global startups and academic groups focusing on IC design innovations and Chip-based innovative applications. Top selections will be invited to establish bases in Taiwan, linking them with funding to advance chip innovations, leveraging the world's most comprehensive semiconductor industry ecosystem to support creative endeavors.

2. Categories
Advanced technologies or solutions for the following areas of development:
--Category 1 - IC design innovations: Academic research or startup with proprietary IC design technology and core IP, planning and developing innovative chips.
--Category 2 - Chip-based innovative applications: Academic research or startup with domain knowledge in various industries and planning to combine existing chip technologies for implementation, such as the following topics:
*Smart Data & Security (cyber-security, quantum computing, digital economy)
*Smart Mobility (electric vehicles, autonomous driving, smart cities)
*Smart Manufacturing (intelligent manufacturing, IC process, robots)
*Smart Medtech (biometrics, smart monitoring)
*Sustainability (sustainable manufacturing, energy-saving innovation)

3. Eligibility
(1) Startups, legal entities, academic research institutions and persons that plan to collaborate with Taiwan’s semiconductor chip design and manufacturing industry. Qualified proposals must meet specific criteria.
 Must be a startup set up after January 1, 2016
 It shall not be a startup/legal entity/academic research institution/person from China or a startup established by people, legal entities or other institutions in China from a third place to invest in Taiwan.
 The source of funds shall not include funds from a third-area enterprise, which refers to a person, juristic person or institution in China that directly or indirectly holds more than 30% of the shares or total capital contribution of the third-area enterprise; or having the ability to control the third-area enterprise.
(2) The participant must own the intellectual property rights of the product, technology or solution or have obtained legal licensing access.
(3) The participant must provide concept paper (for initial review) and deliver a presentation (for secondary review) within the designated time. The content of the concept paper includes the core technology, situations that have been solved or verified so far, the business model to be developed, market expansion plans, etc.

4. Competition process
The award selection process is through online competitions. Teams can participate with no entry limits.
There are two rounds of registration. The first round ends on June 30, 2024, and the second round runs from September 4, 2024, to January 31, 2025. Teams have a two-week grace period after each deadline to complete their application materials.
Online registration: Interested participants can fill in the registration form online at any time and upload required documents.
Please download the file through IC Taiwan Grand Challenge official website: https://ictaiwanchallenge.org

5. Awards
(1) IC Innovation Acceleration Platform Industry Links and Guidance of Chip Development in Taiwan: An initial funding of USD 30,000 will be provided for teams coming to Taiwan. Based on actual needs, teams will be offered in chip development during the project execution period, including access to EDA tools, silicon intellectual property licensing services, IC professional design services, and shuttle services for multi-project wafer (MPW) runs, with a total cap of USD 3 million. This will primarily be conducted through a SAFE (Simple Agreement for Future Equity) model for equity exchange. If the SAFE is not applicable under the regulations of the respective country, alternative equity exchange methods will be negotiated.
(2) Industry Expert Review and Mentorship: A review committee will be formed by senior technical experts from Taiwan's semiconductor industry and venture capitalists. The committee will review the resource requirements proposed by startups on the platform. Based on the identified needs, mentors will be arranged to provide professional guidance and consultation to the selected startups.
(3) Other landing resources: Provide the winning team with the access for office space rental at Taiwan International Start-up Base - Taiwan Tech Arena (TTA) and TTA South (https://www.taiwanarena.tech/) and related business development. The coaching manager serves as a bridge between selected teams and consultants/industry mentors, helping entrepreneurs connect with the necessary resources.
6. Contact
Contact person: Ms. Annett Wu
Contact number: +886 2 25774249 Ext. 312
Email: annett@mail.tca.org.tw

For further information, please visit: https://www.nstc.gov.tw/folksonomy/detail/021bf1c5-75e6-4103-a2b1-54814f53788b?l=en

 

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